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  1. Die Products User Club - Home

    DPUC - The Die Products User Club web site - an international resource for everything related to die products, wafer processing and advanced semiconductor ...
    Die Products User Club0

    www.dpuc.net - 2009-04-04
  2. Inapac

    Intellectual Property & Services For Reliable SiPs Site Map | Home About Us Products & Solutions Partners News & Events Contact Us CUSTOMER LOGIN PASSWORD SIGN ...

    www.inapac.com - 2009-02-13
  3. Electroglas, Inc. - Electroglas wafer probers, test handlers and test floor management software

    Electroglas, Inc., develops advanced wafer probers, device handlers, test floor management software and services for the semiconductor industry.
    back-end manufacturers0
    back-end manufacturing0
    back-end processing0
    EGCommander0
    EG Net0
    Electroglas Inc.0
    sort floor0
    SORTmanager0

    www.electroglas.com - 2009-02-07
  4. International Micro Industries, Inc.

    International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
    Advanced Chip Packaging0
    Au Bumping0
    Bare Die Packaging0
    Copper Pillar Bumps0
    Fine Pitch Bumps0
    Flip Chip Packaging0
    Gold Bump0
    Gold Bumping0
    Indium Bumping0
    Indium Bumps0
    Known Good Packaging0
    Pillar Bumps0
    Sn Bumping0
    Sn Bumps0
    Solder Bumps0
    Tape Automated Bonding0
    Tin Bumps0
    Tin Lead Bumps0
    Wafer Electroplating0
    Wafer Level Processing0

    www.imi-corp.com - 2009-02-06
  5. Welcome to Laurier Incorporated - Manufacturer of Die Sorting and Tray Handling equipment.

    Laurier Inc. of Londonderry, NH has built the largest installed base of semi-automatic and fully automated die sorting systems in the world. Laurier also ...

    www.besidiehandling.com - 2009-02-07
  6. Semiconix Corporation, goldchip technology, silicon printed circuit board, known good die manufacturing and bare die wafer foundry group companies HTE Labs, ...

    wafer foundry, discrete semiconductors, integrated circuits, integrated passive components, BARE DIE ASSEMBLIES, GREEN PACKAGES, LAMINATE CHIP SCALE PACKAGES, ...
    BARE DIE ASSEMBLIES0
    FLIP CHIP KNOWN GOOD BARE DIE0
    integrated passive components0
    LAMINATE CHIP SCALE PACKAGES0
    LEAD LESS CHIP SCALE PACKAGES0
    MOLDED LEAD FRAME PACKAGES0
    SILICON PRINTED CIRCUIT BOARD0
    SILICON SYSTEM IN PACKAGE0
    SYSTEM IN PACKAGE -SIP0

    www.semiconix.com - 2009-02-06
  7. Pelican Packaging

    Pelican Packaging is recognized as a leading providers of full service automated semiconductor packaging. We provide a one stop service for all your packaging ...
    chip desistor0
    die tapping0
    ink dot0
    pelican packaging0
    RF ID Tag0
    stickytape0

    www.pelicanpackaging.com - 2009-02-04
  8. KGD Packaging & Test Workshop

    The annual KGD Packaging and Test Workshop in Napa, California focuses on semiconductor die products test, assembly, manufacturing, and business issues at the ...

    www.napakgd.com - 2009-02-04
  9. Die Products Consortium (DPC)

    The DPC provides information on semiconductor test, assembly, and infrastructure related to known good die (KGD) and implementation of system-in-package (SiP) ...
    die products conosortium0

    www.dieproducts.org - 2009-03-04
  10. The ENCASIT / GOOD DIE project - A KGD Action

    ENCASIT:European Network for the Co-ordination of Advanced System Integration Technologies , European Initiative to Promote Known-Good-Die (KGD) and all ...
    Die standard0
    Good-Die0
    IEC 622580

    www.gooddie.net - 2009-02-12

kgd1 flip chip1 semiconductor2 pcb2 bga1 bare die1 csp1

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