-
DPUC - The Die Products User Club web site - an international resource for everything related to die products, wafer processing and advanced semiconductor ...
Die Products User Club 
www.dpuc.net - 2009-04-04
-
Intellectual Property & Services For Reliable SiPs Site Map | Home About Us Products & Solutions Partners News & Events Contact Us CUSTOMER LOGIN PASSWORD SIGN ...
www.inapac.com - 2009-02-13
-
Electroglas, Inc., develops advanced wafer probers, device handlers, test floor management software and services for the semiconductor industry.
back-end manufacturers  back-end manufacturing  back-end processing  EGCommander  EG Net  Electroglas Inc.  sort floor  SORTmanager 
www.electroglas.com - 2009-02-07
-
International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
Advanced Chip Packaging  Au Bumping  Bare Die Packaging  Copper Pillar Bumps  Fine Pitch Bumps  Flip Chip Packaging  Gold Bump  Gold Bumping  Indium Bumping  Indium Bumps  Known Good Packaging  Pillar Bumps  Sn Bumping  Sn Bumps  Solder Bumps  Tape Automated Bonding  Tin Bumps  Tin Lead Bumps  Wafer Electroplating  Wafer Level Processing 
www.imi-corp.com - 2009-02-06
-
Laurier Inc. of Londonderry, NH has built the largest installed base of semi-automatic and fully automated die sorting systems in the world. Laurier also ...
www.besidiehandling.com - 2009-02-07
-
wafer foundry, discrete semiconductors, integrated circuits, integrated passive components, BARE DIE ASSEMBLIES, GREEN PACKAGES, LAMINATE CHIP SCALE PACKAGES, ...
BARE DIE ASSEMBLIES  FLIP CHIP KNOWN GOOD BARE DIE  integrated passive components  LAMINATE CHIP SCALE PACKAGES  LEAD LESS CHIP SCALE PACKAGES  MOLDED LEAD FRAME PACKAGES  SILICON PRINTED CIRCUIT BOARD  SILICON SYSTEM IN PACKAGE  SYSTEM IN PACKAGE -SIP 
www.semiconix.com - 2009-02-06
-
Pelican Packaging is recognized as a leading providers of full service automated semiconductor packaging. We provide a one stop service for all your packaging ...
chip desistor  die tapping  ink dot  pelican packaging  RF ID Tag  stickytape 
www.pelicanpackaging.com - 2009-02-04
-
The annual KGD Packaging and Test Workshop in Napa, California focuses on semiconductor die products test, assembly, manufacturing, and business issues at the ...
www.napakgd.com - 2009-02-04
-
The DPC provides information on semiconductor test, assembly, and infrastructure related to known good die (KGD) and implementation of system-in-package (SiP) ...
die products conosortium 
www.dieproducts.org - 2009-03-04
-
ENCASIT:European Network for the Co-ordination of Advanced System Integration Technologies , European Initiative to Promote Known-Good-Die (KGD) and all ...
Die standard  Good-Die  IEC 62258 
www.gooddie.net - 2009-02-12
|
kgd
flip chip
semiconductor
pcb
bga
bare die
csp
|
|